Design and Fabrication of Ultra-thin Flexible Substrate

We present the development of a flexible polyimide substrate that act as the conduit for power and signal transmission with the additional features of precise control of the metal trace geometries. Using microfabrication techniques, a metal trace is fabricated that possesses a flexible polyimide-based interconnection. The performance of the design was measured with multimeter. The HFSS simulation result of copper-plated interconnection with a core thickness of 12 um has an impedance value of 50 ohm at 1 GHz. Investigated of microfabrication were performed using an energydispersive spectrometry (EDS) and Zygo Optical Profilometer in order to verify the visual aspects of the Cu interconnection, such as identification the elemental composition of materials, roughness and thickness. The experiment is conducted to study the effect of the process parameters on the Cu film surface properties. The results obtained in this work can be applied to the fabrication of flexible microelectronic devices.